tel : +44 118 979 1238 fax : +44 118 979 1283 email: info@actcrystals.com in keeping with our ongoing policy of product evolvement and improvement, the above specification is subject to change without notice. iso9001: 2000 registered for quotations or further information please contact us at: 3 the business centre, molly millars lane, wokingham, berks, rg41 2ey, uk http://www.actcrystals.com 1 of3 the actf318/318.0/to39 is a low-loss, compact, and economical surface-acoustic-wave ( saw ) filter in a low-profile metal to-39 case designed to provide front-end selectivity in 318.000 mhz receivers. receiver designs using this filter include superhet with 10.7 mhz or 500 khz if, direct conversion and superregen. 1.package dimension (to-39) 2. 3. test circuit pin configuration 1 input / output 2 output / input 3 case ground dimension data (unit: mm) a 9.300.20 b 5.080.10 c 3.400.20 d 30.20 M 50.20 e 0.450.20 issue : 1 c1 date : sept 04
tel : +44 118 979 1238 fax : +44 118 979 1283 email: info@actcrystals.com in keeping with our ongoing policy of product evolvement and improvement, the above specification is subject to change without notice. iso9001: 2000 registered for quotations or further information please contact us at: 3 the business centre, molly millars lane, wokingham, berks, rg41 2ey, uk http://www.actcrystals.com 2 of3 4.typical frequency response 5.performance 5-1.maximum rating rating value units cw rf power dissipation +10 dbm dc voltage between any two pins 30v vdc case temperature -40 to +85 c 5-2.electronic characteristics issue : 1 c1 date : sept 04
tel : +44 118 979 1238 fax : +44 118 979 1283 email: info@actcrystals.com in keeping with our ongoing policy of product evolvement and improvement, the above specification is subject to change without notice. iso9001: 2000 registered for quotations or further information please contact us at: 3 the business centre, molly millars lane, wokingham, berks, rg41 2ey, uk http://www.actcrystals.com 3 of3 reference temperature: t a = 25 c terminating source impedance: z s = 50 and matching network terminating load impedance: z l = 50 and matching network characteristic minimum typical maximum units centre frequency f c (centre frequency between 3db points) 318.000 mhz insertion loss il -- 3.5 5.0 db 3db pass band bw 3 300 khz passband ripple 1.0 db at f c -21.4mhz (image) 40 50 -- at f c -10.7mhz (lo) 15 30 -- rejection ultimate -- 60 -- db turnover temperature t o 25 55 turnover frequency f o fc mhz temperature frequency temperature coefficient ftc 0.03 ppm/ c 2 frequency aging absolute value during the first year |fa| 10 ppm/yr caution: electrostatic sensitive device. observe precautions for handling ! 1. the frequency f c is defined as the midpoint between the 3db frequencies. 2. unless noted otherwise, all measurements are made with the filter installed in the specified test fixture that is connected to a 50 test system with vswr 1.2:1. the test fixture l and c are adjusted for minimum insertion loss at the filter centre frequency, f c . note that insertion loss, bandwidth, and passband shape are dependent on the impedance matching component values and quality. 3. unless noted otherwise, specifications apply over the entire specified operating temperature range. 4. frequency aging is the change in f c with time and is specified at +65c or less. aging may exceed the specification for prolonged temperatures above +65c. typically, aging is greatest the first year after manufacture, decreasing in subsequent years. 5. turnover temperature, t 0 , is the temperature of maximum (or turnover) frequency, f 0 . the nominal frequency at any case temperature, t c , may be calculated from: f = f 0 [1 - ftc (t 0 - t c ) 2 ]. 6. the specifications of this device are based on the test circuit shown above and subject to change or obsolescence without notice. 7. all equipment designs utilizing this product must be approved by the appropriate government agency prior to manufacture or sale. 8. our liability is only assumed for the surface acoustic wave (saw) component(s) per se, not for applications, processes and circuits implemented within components or assemblies. issue : 1 c1 date : sept 04
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